TDA3 / DRA78XEVM(EVMTDA3G-02-40-00)
TDA3X Evaluation Module AVAILABILE IN JUNE 2021 Hardware Features TDA3X CPU BOARD TDA3x Processor 4GB DDR3L 1GB QSPI, 512MB NOR 256KB I2C EEPROM SD/MMC Socket LP8733 & LP8732 PMICs So..
TDA3X Evaluation Module AVAILABILE IN JUNE 2021 Hardware Features TDA3X CPU BOARD TDA3x Processor 4GB DDR3L 1GB QSPI, 512MB NOR 256KB I2C EEPROM SD/MMC Socket LP8733 & LP8732 PMICs So..
J6 DRA77xP/DRA76xP CPU EVM Board Hardware Features TDA2X CPU BOARD DRA77x Processor 4GB DDR3L TPS65917 + LP87565 Power Management IC Devices 4 GB eMMC Compatible with TDA2P/TDA4-ACD EVM and Te..
J6/DRA74x/DRA75x/TDA2x CPU Board Hardware Features TDA2X CPU BOARD TDA2x Processor 4GB DDR3L TPS659039 Power Management IC 4 GB eMMC Compatible with TDA2P/TDA4-ACD EVM and Texas Instruments TDA4VMX..
Fusion Application Daughter Board Hardware Features Fusion Application Board 4 Camera Inputs 4 Radar Inputs 4 HSD Inputs Dual 960 FPD-Link to CSI2 interface Compatible with TDA2P/TDA4-ACD EVM ..
The HDD Thermal Test Vehicle (TTV) is a representation of a “typical” HDD/SSD to be used for evaluating thermal, airflow and mechanical designs of a server. Thermal Details: The TTV is adjustable from 2.5W to 25W total power via jumpers lo..
OMAP™ 4460 application processor is a Texas Instrument chip with Dual-core ARM Cortex A9 MP Core Key Features and Benefits Dual-core ARM Cortex-A9 MPCore SMP general-purpose processors for higher performance and efficiency
SOM437x is a System-On-Module for AM437x CPU. It has AM437X, DDR3, PMIC(TPS65218), eMMC or NAND FLASH, Gigabit PHY on board and uses 2.0mm DIP connector. Except for the DDR3 pins and power pins all CPU pins have been connect out to the DIP Conn..
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